Methods and apparatus for additively manufacturing a structure with in-situ reinforcement

ABSTRACT

A method of additive manufacturing is provided. The method of additive manufacturing includes depositing a layer of base material from which an additively manufactured part is produced. The method also includes dissolving a resin in a solvent to form a resin solution, and depositing the resin solution upon the layer of base material.

CROSS-REFERENCE TO RELATED APPLICATIONS

This patent application is related to U.S. patent application Ser. No.16/146,389 (having attorney docket number 18-0875-US-NP[1]) and filed onSep. 28, 2018, and U.S. patent application Ser. No. 16/146,405 (havingattorney docket number 18-0875-US-NP[3]) and filed on Sep. 28, 2018, thedisclosures of which are incorporated by reference herein in theirentireties. For further identification of the aforementioned relatedapplications, it is noted that the as filed title is the same for thispatent application and the aforementioned related patent applications.

BACKGROUND 1. Field

The exemplary embodiments generally relate to additive manufacturing andmore particularly to additively manufacturing structures with in-situreinforcement.

2. Brief Description of Related Developments

Generally, in additive manufacturing, powder is spread on a build plate(or on a powder bed formed by a previous layer of powder deposited onthe build plate) or filaments of material are deposited on the buildplate (or on top of a previously deposited layer of filaments) in aside-by-side arrangement. The powder or filaments are then fusedtogether to form a desired part/article of manufacture (referred toherein as a “structure”). Fusing of the particles may be achieved withlasers or any other suitable energy source configured to fuse the powderor filaments together. As the powder is deposited, voids and/or poresare formed between the particles of powder and between adjacent layersof powder formed thereby. For example, the particles of powder have agenerally spherical shape which when abutted against other particles maycreate the voids and/or pores. Similarly, as the filaments aredeposited, the cylindrical shape of the filament may result in the voidsand/or pores between adjacent filaments and between adjacent layers offilaments formed thereby. The voids and pores may also result fromvariations in the deposition process.

The additively manufactured structures may have poor surface finishes asa result of the voids and/or pores. Further, the additively manufacturedstructures may exhibit anisotropic mechanical properties. For example,considering a three dimensional (X, Y, Z) structure where the filamentor powder layers are deposited in the X-Y plane and are stacked on topof each other in the Z direction. For exemplary purposes only, thetensile force of the structure in the Z direction may be about 40% toabout 55% of the tensile force of the structure in the X-Y plane. Thisanisotropic behavior may be due to the presence of the voids and/orpores between the layers of the powder or filaments.

In addition to the above, structures can be produced with additivemanufacturing using a variety of base materials (e.g., metals, polymers,and ceramics); however, while the base material may be chosen,conventional additive manufacturing techniques do not provide theability to fine tune or change properties (e.g., such as conductivity)of the structure formed by the base material. For example, if the basematerial is a conductor, the resulting structure formed with the basematerial will be conductive. Likewise, if the base material is aninsulator, the resulting structure formed with the base material will beinsulative and, conventionally, additive manufacturing processes do notprovide for imparting conductivity to the insulating structure.

SUMMARY

Accordingly, apparatuses and methods intended to address, at least, theabove-identified concerns would find utility.

The following is a non-exhaustive list of examples, which may or may notbe claimed, of the subject matter according to the present disclosure.

One example of the subject matter according to the present disclosurerelates to a method of additive manufacturing, the method comprises:depositing a layer of base material from which an additivelymanufactured part is produced; dissolving a resin in a solvent to form aresin solution; and depositing the resin solution upon the layer of basematerial.

Another example of the subject matter according to the presentdisclosure relates to a method of additive manufacturing, the methodcomprises: depositing a layer of base material; dissolving a resin in asolvent to form a resin solution; and depositing the resin solution uponthe layer of base material; wherein the layer of base material and theresin solution are alternately deposited to form stacked layers of basematerial with the resin solution interstitially disposed between thestacked layers of base material, the resin solution at least partiallyfilling one or more of voids and pores between adjacent layers of basematerial in the stacked layers of base material so as to reinforcecoupling of the adjacent layers of base material.

Still another example of the subject matter according to the presentdisclosure relates to an additively manufactured part comprising: atleast one layer of base material; and a reinforcing agent disposed onthe at least one layer of base material, where the reinforcing agent isdeposited upon the at least one base layer as a resin solution so as toat least partially fill one or more of voids and pores in the at leastone layer of base material, wherein the resin solution effects couplingof the at least one layer of base material so that the additivelymanufactured part exhibits substantially isotropic mechanical strength.

Yet another example of the subject matter according to the presentdisclosure relates to an additive manufacturing apparatus comprising: aframe; a base material support bed coupled to the frame; a base materialdeposition unit movably coupled to the frame and being disposed abovethe base material support bed, the base material deposition unit beingconfigured to deposit one or more layers of base material upon the basematerial support bed; and a deposition device coupled to the frame so asto be positioned relative to the frame and being configured so as todeposit a resin solution upon the one or more layers of base material,in situ with the deposition of the one or more layer of base material.

BRIEF DESCRIPTION OF THE DRAWINGS

Having thus described examples of the present disclosure in generalterms, reference will now be made to the accompanying drawings, whichare not necessarily drawn to scale, and wherein like referencecharacters designate the same or similar parts throughout the severalviews, and wherein:

FIG. 1A is a schematic block diagram of an additive manufacturingapparatus in accordance with aspects of the present disclosure;

FIG. 1B is a schematic block diagram of a reinforcing agent/material inaccordance with aspects of the present disclosure;

FIG. 1C is a schematic block diagram of a particle of structuralmaterial in accordance with aspects of the present disclosure;

FIG. 1D is a schematic block diagram of a conductive material inaccordance with aspects of the present disclosure;

FIG. 1E is a schematic block diagram of an additively manufactured part(also referred to herein as an additively manufactured structure”)formed by the additive manufacturing apparatus of FIG. 1A and includingone or more of the reinforcing agent, the particle of structuralmaterial, and the conducting material of FIGS. 1B, 1C, and 1D inaccordance with aspects of the present disclosure;

FIGS. 2A, 2B, and 2C are exemplary end view illustrations of filamentsof material deposited by the additive manufacturing apparatus of FIG. 1Awith varying degrees of “air gap” between the filaments in accordancewith aspects of the present disclosure;

FIG. 3A is an exemplary illustration of the additive manufacturingapparatus of FIG. 1A in accordance with aspects of the presentdisclosure;

FIG. 3B is an exemplary illustration of the additive manufacturingapparatus of FIG. 1A in accordance with aspects of the presentdisclosure;

FIGS. 4A, 4B, and 4C are exemplary end view illustrations of adeposition of filaments of material with the additive manufacturingapparatus of FIG. 1A showing a progressive stacking of layers of thefilaments in accordance with aspects of the present disclosure;

FIG. 5A is a perspective view of an exemplary additively manufacturedpart in accordance with aspects of the present disclosure;

FIG. 5B is a perspective view of a portion of the additivelymanufactured part of FIG. 5A in accordance with aspects of the presentdisclosure;

FIG. 5C is an end view illustration of the portion of the additivelymanufactured part of FIG. 5B in accordance with aspects of the presentdisclosure;

FIG. 6 is an exemplary illustration of the additive manufacturingapparatus of FIG. 1A in accordance with aspects of the presentdisclosure;

FIGS. 7A and 7B are exemplary side view illustrations of a deposition ofpowder with the additive manufacturing apparatus of FIG. 1A showing aprogressive stacking of layers of the powder in accordance with aspectsof the present disclosure;

FIG. 8 is an exemplary flow diagram of a method of additivemanufacturing in accordance with aspects of the present disclosure;

FIG. 9 is an exemplary flow diagram of a method of additivemanufacturing in accordance with aspects of the present disclosure; and

FIG. 10 is an exemplary flow diagram of a method of additivemanufacturing in accordance with aspects of the present disclosure.

DETAILED DESCRIPTION

Referring to FIG. 1A, an additive manufacturing apparatus 100 isillustrated. In one aspect, the additive manufacturing apparatus 100 isconfigured to produce an additively manufactured part 150 by, materialextrusion (e.g., Fused Filament Fabrication, Fused Deposition Modeling,etc.) where the base material 120 is extruded through a nozzle ororifice in tracks or beads (i.e., filaments 121F, 122F, 123F), which aredeposited on a base material support bed 103 and then consolidated(e.g., heated to bond the filaments together) to form the additivelymanufactured part 150. In another aspect, the additive manufacturingapparatus 100 is configured to produce the additively manufactured part150 by directed energy deposition (e.g., laser metal deposition, laserengineered net shaping, direct metal deposition, etc.) where the basematerial 120 (as a powder or wire) is fed into a melt pool which hasbeen generated on the surface of the additively manufactured part 150where it adheres to the underlying part or layers by using an energysource 107, such as a laser or electron beam. In still another aspect,the additive manufacturing apparatus 100 is configured to produce theadditively manufactured part 150 by powder bed fusion (e.g., selectivelaser sintering, direct metal laser sintering, laser melting, selectiveheat sintering, multi-jet fusion, etc.) where the base material 120, ina powdered form (e.g., powder 121P, 122P, 123P), is deposited on thebase material support bed 103 and consolidated (e.g., heated to bond thepowder particles together) using the energy source 107 to form theadditively manufactured part 150.

As the base material 120 is deposited onto the base material support bed103, adjacent previously deposited filaments 121F, 122F, 123F, adjacentpreviously deposited powder 121P, 122P, 123P, or adjacent previouslydeposited base material 120 (e.g., deposited as a melt pool or slurryand at least partially solidified) at least partially adhere to eachother. In some instances this partial adherence forms voids 201 and/orpores 200 (FIGS. 2A, 2B, 2C) to form between layers 151 of base material120 and/or between adjacent filaments 121F, 122F, 123F, particles 600(see FIG. 6) of powder 121P, 122P, 123P, or previously depositedpartially solidified base material 120 within a common layer 151. Thesevoids 201 and/or pores 200 may lead to anisotropic mechanical propertiesof the additively manufactured part 150.

The aspects of the present disclosure provide for in-situ (e.g., duringthe formation of the additively manufactured part 150 with the additivemanufacturing apparatus 100) reinforcement of the additivelymanufactured part 150. In accordance with the aspects of the presentdisclosure, a reinforcing agent/material 185, 193 is deposited, duringthe fabrication of the additively manufactured part 150, onto each (orat least one) layer 151 of base material 120 after the deposition ofeach (or the at least one) layer 151 of base material 120. Thereinforcing agent 185, 193 settles in the interstitial voids 201 and/orpores 200 (FIGS. 2A, 2B, 2C) created by un-melted portions of the basematerial 120 and/or partially fused portions of the base material 120,where the reinforcing agent 185, 193 at least partially fills the voids201 and/or pores 200 (FIGS. 2A, 2B, 2C) and effects densification of theadditively manufactured part 150.

The reinforcing agent 185, 193 may be deposited in the form of a resin(or polymer) solution 180 or a slurry 190, where the resin solution 180or slurry 190 is sprayed, brushed, rolled, or applied in any othersuitable manner onto the respective layer 151 of base material 120. Theresin solution 180 may be prepared by dissolving any suitable resin,such as thermoplastic resin 183, in a suitable solvent 181 (e.g., toform a dissolved resin 182) with the reinforcing agent 185 held insuspension. The slurry 190 may be formed by optimizing (e.g., dependingon a design of a spray nozzle, desired viscosity for feeding the slurrythrough a distribution system, etc.) an amount of suitable solvent 195(which may include a dissolved resin 182, such as the thermoplasticresin 183), particles of a structural material 194, and a reinforcingagent 193 for combination into the slurry 190.

The solvent 181,195 may be a low surface tension solvent such asacetone, ethanol, N-Methyly-2-Pyrrolidone (NMP), N,N-dimethyl formamideor any other suitable solvent. As an example, of a low surface tension,the solvent may have a surface tension of about 22 mN/m to about 41mN/m. In other aspects the solvent may have a surface tension may beless than about 22 mN/m or greater than about 41 mN/m. In still otheraspects the solvent may have a surface tension that is less than thesurface tension of water (e.g., less than about 73 mN/m).

Referring also to FIG. 1B, the reinforcing agent 185, 193 may be apolymeric reinforcing agent 185A or non-polymeric reinforcing agent185B. For example, the reinforcing agent 185, 193 may include, but isnot limited to, one or more of nanoparticles 185D, two-dimensionalnano-sheets 185E (e.g., organic or inorganic), carbon nanotubes 185F,nano-platelets 185C (e.g., nano-clay, transition metal dichalcogenides(e.g., such as MoS2 and WS2), etc.), graphene 185G, graphene reinforcedfilaments 185H, and graphene derivatives 185I (e.g., including but notlimited to hydrogenated graphene (graphane), fluorinated graphene(fluorographene), oxidized graphene (graphene oxide), and grapheneintroduced by acetylenic chains (graphyne and graphdiyne)). Referringalso to FIG. 1C, the particles of the structural material 194 include,but are not limited to, one or more of polymeric particles 194B (that inone aspect are different than the base material 120 and in other aspectsare the same as the base material 120), particles of the base material194A, metallic particles 194C (that in one aspect are different than thebase material 120 and in other aspects are the same as the base material120), and ceramic particles 194D. Where the particles of the structuralmaterial 194 include metallic particles 194C, the slurry 190 may includeany suitable organic binder 191 (see FIG. 1) (noting that the particlesof structural material 194 may function as the organic binder 191 wherethe particles of structural material 194 are, e.g., polymeric or apolymer). In one aspect, the conversion of the combination of thesolvent 195, the particles of structural material 194 and thereinforcing agent 193 to the slurry 190 may be aided by the applicationof thermal energy or any other suitable processing.

In one aspect, the resin solution 180 and/or slurry 190 includes aconductive material 184. Referring also to FIG. 1D, the conductivematerial 184 may be any suitable conductive material including, but notlimited to, conducting ink 184A, carbon based nano-materials 184B (suchas, e.g., the carbon nanotubes 185F, graphene 185G, the graphenereinforced filaments 185H, and the graphene derivatives 185I),conducting polymers 184C, and nano-silver 184D (or other nano-metals).

The aspects of the present disclosure provide for the manufacture of anadditively manufactured part 150 having substantially the samemechanical properties in both the X-Y plane (see FIGS. 5A-5C) and the Zdirection where the resin solution 180 and/or slurry 190 settles (e.g.,fills in) the voids 201 and/or pores 200 (FIGS. 2A, 2B, 2C) that may begenerated by the partial melting of the base material 120 (or formed inany other manner) so as to densify the additively manufactured part 150.The aspects of the present disclosure provide for bonding betweenadjacent layers 151, between adjacently deposited filaments 121F, 122F,123F, and between adjacently deposited particles 600 (FIG. 6) of powder121P, 122P, 123P.

The aspects of the present disclosure also provide for the modificationor tuning of the conductive properties of the additively manufacturedpart 150. For example, where the additively manufactured part 150 isconstructed of a non-conductive base material 120, the conductivematerial 184 of the resin solution 180 and/or slurry 190 depositedbetween one or more layers 151 of the additively manufactured part 150may provide any suitable thermally and/or electrically conductivepathways through the additively manufactured part 150. Where theadditively manufactured part 150 is constructed of a conductive basematerial 120, the resin solution 180 and/or slurry 190 deposited betweenone or more layers 151 of the additively manufactured part 150 may haveas a reinforcing agent 185, 193 the particles of structural material 194or a non-conductive material that is present in sufficient quantities tothermally and/or electrically isolate one or more layers 151 of theadditively manufactured part from one or more other layers of theadditively manufactured part 150. The aspects of the present disclosuremay also provide the additively manufactured part 150 with barrierproperties, such as, e.g., properties of impermeability. For example,the nano-platelets 185C form a barrier material 199 (FIG. 1B) thateffects or forms a barrier 400 on an exterior surface 500 (FIGS. 4C, 5,7B) of the additively manufactured part 150 or the barrier 400 betweenone or more layers 151 (FIGS. 4C, 7B) of the additively manufacturedpart 150, where the barrier 400 substantially prevents passage of fluids(e.g., gas, liquid, etc.).

The aspects of the present disclosure provide for the in-situreinforcement of additively manufactured parts 150 during manufacturingthat is not energy intensive and without post processing of theadditively manufactured part 150 (e.g., without processing steps toreinforce the additively manufactured part after manufacture of the partby additive manufacturing). The aspects of the present disclosure mayalso be retrofit/integrated into existing three-dimensional printersused for additive manufacturing. The aspects of the present disclosuremay also provide the additively manufactured part 150 with spatiallyvariable properties (e.g., conductive and/or barrier properties atpredetermined areas of the additively manufactured part 150).

Referring now to FIGS. 1A, 3A, and 3B, the additive manufacturingapparatus 100 may be configured to manufacture the additivelymanufactured part 150 with any suitable polymeric material 121, anysuitable metal 122, or any suitable polymer 123. The additivemanufacturing apparatus 100 includes a frame 101, a base materialsupport bed 103, a base material deposition unit 104 (to deposit thebase material 120), a deposition device 105, a reservoir 106, a computercontrolled positioning mechanism 175, a controller 170, a heater 108,and any suitable energy source 107 (e.g., to heat the deposited basematerial 120 for fusing/consolidating the base material 120). The basematerial support bed 103 is coupled to the frame 101 in any suitablemanner. The base material deposition unit 104 is movably coupled to theframe 101 in any suitable manner and is disposed above the base materialsupport bed 103. The base material deposition unit 104 is configured todeposit one or more layers 151 of the base material 120 (either inpowder 121P, 122P, 123P or filament 121F, 122F, 123F form) upon the basematerial support bed 103.

The deposition device 105 is coupled to the frame so as to be positioned(either fixed or movably) relative to the frame 101 and is configured soas to deposit the resin solution 180 and/or slurry 190 upon the one ormore layers 151 of base material 120, in situ with the deposition of theone or more layer 151 of base material 120. In one aspect, thedeposition device 105 includes a spray nozzle 105S that is fixed (e.g.,stationarily coupled to the frame 101—see FIG. 3A) relative to the basematerial support bed 103. In another aspect, the deposition device 105is movably coupled to frame 101. For example, the deposition device 105and the base material deposition unit 104 may be movably coupled to theframe by a computer controlled positioning mechanism 175 having at leastone drive unit 176. In one aspect, each of the base material depositionunit 104 (illustrated for exemplary purposes in FIGS. 3A and 3B as beingconfigured to deposit filaments of base material) and the depositiondevice 105 are coupled to a respective one of a base material depositionunit drive 176B and a deposition device drive 176A so as to be movablerelative to each other and the base material support bed 103 (see FIG.3A). In another aspect, the base material deposition unit 104 and thedeposition device 105 are configured so as to move together as a singleunit relative to the frame 101 and the base material support bed 103(see FIG. 3B). For example, the deposition device may be coupled to thebase material deposition unit 104, so that both are movable as a singleunit with by base material deposition unit drive 176B. The controller170 is configured to control at least positioning movement (such as inthe X-Y plane and/or in the Z direction) of one or more of the basematerial deposition unit 104 and the deposition device 105, and in someaspects the base material support bed 103, so as to deposit the basematerial 120, the resin solution 180, and/or the slurry 190 in themanner(s) described herein.

The deposition device 105, may be configured as, e.g., the spray nozzle105S (e.g., where the resin solution 180 or slurry 190 exits thedeposition device 105 through the spray nozzle), a brush 105B, a roller105R, or as a solution-deposition planarization unit 105D (see FIGS. 1Aand 3A) or any other suitable deposition apparatus configured to depositthe resin solution 180 and/or slurry 190 onto the layers 151. In oneaspect, the deposition device 105 is configured to effect deposition ofthe resin solution 180 upon the layer(s) 151 of base material 120 byapplication of a low surface tension melt 740 (see FIG. 7A) (e.g., thethermoplastic resin 183 in the resin solution 180 has a lower molecularweight than the base material 120 (but can have the same or differentchemistry as the base material 120) so that the thermoplastic resin 183melts at a lower temperature than the base material 120). Depending onthe configuration of the deposition device 105, where the depositiondevice 105 is movable, the deposition device drive 176A is suitablyconfigured to move the deposition device 105 so that the resin solution180 and/or slurry 190 is deposited by spraying, brushing, rolling, orsolution-deposition planarization. While the base material depositionunit 104 and the deposition device 105 are described as being movablerelative to the base material support bed 103, in other aspects, thebase material support bed 103 may be movable relative to the one or moreof the base material deposition unit 104 and the deposition device 105.

With reference to FIG. 1A, the frame 101 forms a chamber 102 thatencloses at least a portion of the deposition device 105, such as thespray nozzle 105S, the brush 105B, the roller 105R, or thesolution-deposition planarization unit 105D of the deposition device105. In one aspect, the chamber 102 encloses at least the portion of thedeposition device 105, the base material deposition unit 104, and thebase material support bed 103.

The reservoir 106 is configured to store the resin solution 180 and/orslurry 190 in any suitable manner. For example, the reservoir 106 mayinclude a storage tank(s) for resin solution 180 and/or slurry 190(e.g., where the resin solution 180 and slurry 190 are stored inrespective storage tanks). The reservoir 106 is coupled to thedeposition device 105 in any suitable manner, such as through suitableconduits, so as to supply the resin solution 180 and/or slurry 190 tothe deposition device 105. The reservoir 106 may include any suitablepumps that may be controlled by the controller 170 to effect supply ofthe resin solution 180 and/or slurry 190 to the deposition device 105.The heater 108 is any suitable heater configured to heat the resinsolution 180 and/or slurry 190 deposited upon the layer of base material120, so as to reduce an amount of solvent 181, 195 in the resin solution180 and/or slurry 190, which permits the stacked layers 151S (see FIGS.4C, 5B, 5C, and 7B) of base material 120 to be consolidated with eachother.

Referring to FIGS. 1A and 1E, the additively manufactured part 150 inaccordance with the aspects of the present disclosure, as manufacturedby the additive manufacturing apparatus 100, includes at least one layerof base material 120. At least the reinforcing agent 185, 193 isdisposed on the at least one layer 151 of base material 120, where thereinforcing agent is deposited upon the at least one layer 151 as theresin solution 180 or the slurry 190 so as to at least partially fillone or more of the voids 201 and the pores 200 (FIG. 2A-2C) in the atleast one layer 151 of base material 120. In one aspect, the conductivematerial 184 disposed on the at least one layer 151 of base material 120(such as the polymeric material 121 or the polymer 123), where theconductive material 184 is deposited (in addition to or in lieu of thereinforcing agent 185, 193) upon the at least one layer 151 as the resinsolution 180 or the slurry 190, so as to at least partially fill one ormore of the voids 201 and the pores 200.

In one aspect, the at least one layer 151 of base material 120 includesmore than one layer 151 of base material 120 (see layers 151, 151A,151B). The reinforcing agent 185, 193, conductive material 184, and/orthe barrier material 199 is interstitially disposed between adjacentlayers 151 of the base material 120 (see FIGS. 4C, 5C, and 7B) and/or isdisposed on the exterior surfaces 500, at least partially filling theone or more of the voids 201 and pores 200 (FIG. 2A-2C). The reinforcingagent 185, 193, conductive material 184, and/or the barrier material 199at least partially fills the one or more of the voids 201 and pores 200so as to reinforce coupling of the adjacent layers 151 of base material120, provide conductivity (e.g., thermal and/or electricalconductivity), magnetic properties, and/or barrier properties (e.g.,such as there the nano-platelets 185C are included in the slurry) to theadditively manufactured part 150. In one aspect, the at least one layer151 of base material 120 includes a polymer (e.g., such as included inthe polymeric material 121 or the polymer 123). In another aspect, theat least one layer 151 of base material 120 includes a metal 122, whichin one aspect includes metallic particles. In one aspect, the resinsolution 180 or slurry 190, including the conductive material 184 and/orbarrier material 199 is deposited upon predetermined portions 598 (FIG.5C) of the at least one layer 151 of base material 120 so as to vary theconductive properties and/or properties of impermeability across the atleast one layer 151 of base material 120, where a resin solution 180 orslurry 190 that does not include the conductive material 184 and/or thebarrier material 199 is deposited on the other portions of the at leastone layer 151. The deposit patterns of the resin solution 180 or slurry190 may be aligned in predetermined directions so as to provide anydesired anisotropic conductivity.

Referring now to FIGS. 1, 2A-2C, 3A, 3B, 6, 7, and 8, an exemplarymethod of additive manufacturing using the additive manufacturingapparatus 100 will be described. A layer 151 of base material 120 fromwhich the additively manufactured part 150 is produced is deposited(FIG. 8, Block 800) onto the base material support bed 103. In oneaspect (as shown in FIGS. 3A, 3B and 4A-4C), the layer 151 of basematerial 120 is formed by depositing (with, for example, a nozzle 310 ofthe base material deposition unit 104) a plurality of filaments 300(where the plurality of filaments 300 include filaments 121F, 122F, 123Fof one of the polymeric material 121, the metal 122, or the polymer 123)on the base material support bed 103 in a side-by-side arrangement.Where the base material 120 is deposited in the form of a filament 121F,122F, 123F, a spacing or air gap 250A, 250B, 250C between adjacentfilaments 121F, 122F, 123F (e.g., from a center of one filament to acenter of an adjacent filament) may be adjusted to provide increased ordecreased coupling between the adjacent filaments 121F, 122F, 123F. Forexample, the air gap 250A shown in FIG. 2A is smaller than the air gap250B shown in FIG. 2B; and the air gap 250B shown in FIG. 2B is smallerthan the air gap 250C shown in FIG. 2C. Likewise, the coupling area 260Abetween adjacent filaments 121F, 122F, 123F shown in FIG. 2A effected bythe air gap 250A is larger than the coupling area 260B between adjacentfilaments 121F, 122F, 123F shown in FIG. 2B effected by the air gap250B; and the coupling area 260B between adjacent filaments 121F, 122F,123F shown in FIG. 2B effected by the air gap 250B is larger than thecoupling area 260C between adjacent filaments 121F, 122F, 123F shown inFIG. 2C effected by the air gap 250C. The voids 201 and/or pores 200formed by the air gaps may be filled with the slurry 190, so that theair gap may be adjusted (e.g., larger or smaller) while maintainingsubstantially similar mechanical properties (e.g., tensile strength,etc.) of the additively manufactured part 150. In another aspect (asshown in FIGS. 6, 7A, and 7B), the layer 151 of base material 120 isformed by depositing (e.g., by spreading with, for example, doctor blade620 of the base material deposition unit 104) a powdered base material610 (where the powdered base material 610 includes powder 121P, 122P,123P of one of the polymeric material 121, the metal 122, or the polymer123) on the base material support bed 103.

Referring also to FIGS. 4A-4C and 6, the slurry 190 is deposited (e.g.,by spraying, brushing, rolling, solution-deposition planarization, etc.)onto the layer 151 of base material 120 (FIG. 8, Block 810). In oneaspect, depositing the slurry 190 onto the layer 151 of base material120 includes spraying the slurry 190 onto the layer 151 of base material120 with the spray nozzle 105S of the deposition device 105. In oneaspect, the spray nozzle 105S is stationarily fixed to the frame 101 andthe base material 120 deposited onto the base material support bed 103.In other aspects, the spray nozzle 105S of the deposition device 105 ismovable and is positioned relative to the layer 151 of base material 120with the computer controlled positioning mechanism 175. One or more ofthe voids 201 and/or pores 200 on a surface of the layer 151 of basematerial 120 are filled with the slurry 190 (FIG. 8, Block 820—see FIGS.4B and 7A). As can be seen in FIGS. 4B and 7A, the layer 151 of basematerial 120 is planarized by the slurry 190 so that, when another layer151 of the base material is deposited on top of the slurry 190, anyvoids 201 and/or pores 200 that may form between the adjacent layers 151of base material 120 in the resulting stacked layers 151S is/are filledby the slurry 190.

Another layer 151 (see FIGS. 4C and 7B) of base material 120 isdeposited on top of the layer 151 of base material upon which the slurry190 has been applied (FIG. 8, Block 800) to form stacked layers 151S(see FIGS. 4C and 7B) of base material 120. The slurry 190 is depositedonto the other layer 151 of base material 120 (FIG. 8, Block 810—seeFIGS. 4C and 7B) so that the one or more of the voids 201 and/or pores200 on a surface of the other layer 151 of base material 120 are filledwith the slurry 190 (FIG. 8, Block 820—see FIGS. 4C and 7B), where theslurry 190 at least partially fills the one or more of the voids 201 andpores 200 between adjacent layers 151 of the base material 120 in thestacked layers 151S of base material 120 so as to reinforce coupling ofthe adjacent layers 151 of base material 120.

In one aspect, one or more of a thermal conductivity, an electricalconductivity, and a permeability of an additively manufactured partformed by the base material 120 is modified with the slurry 190 (FIG. 8,Block 830). For example, referring to FIGS. 5A, 5B, and 5C, the slurry190 includes one or more of the conductive material 184 and the barriermaterial 199 (FIG. 1B). As described above, where the base material 120is deposited in the form of filaments 121F, 122F, 123F, the air gap250A, 250B, 250C between adjacent filaments forms one or more of voids201 and pores 200 that extend, in for example, an X direction of theadditively manufactured part 150. The conductive material 184 settles inthese voids 201 and/or pores 200 to form conductive pathways 520 (e.g.,which may be akin/similar to wire conductors, each having an equivalentwire gauge or size) that also extend in the X direction. The wire gaugeor size of these conductive pathways 520 may be controlled by settingthe air gap 250A, 250B, 250C to effect a predetermined wire gauge of theconductive pathway 520, noting the wire gauges available may depend on adiameter of the filament 121F, 122F, 123F being deposited. Where thebase material is deposited in the form of a powder 121P, 122P, 123P (asillustrated in FIG. 7B), the conductive material may settle in the voids201 and/or pores 200 to form a conductive plane (or sheet) 700 betweenadjacent layers 151 of the base material 120. In this aspect, theconductive plane 700 may extend in the X and Y directions (e.g., the X-Yplane). The barrier material 199 may also settle within the voids 201and/or pores 200 to form the barrier 400 to prevent fluids from passingbetween the adjacent filaments 121F, 122F, 123F.

The slurry 190 deposited upon the layer 151 of base material 120 isheated (FIG. 8. Block 840) so as to reduce an amount of solvent 195 inthe slurry 190. Reducing the amount of solvent 195 facilitates theconsolidation of the layers 151 of base material 120 to each other andthe densification of the additively manufactured part 150 by curing theslurry 190 (e.g., one or more of the reinforcing agent 193, theconductive material 184, and the particles of structural material 194bond to the adjacent layers 151 of base material 120, to the adjacentfilaments 121F, 122F, 123F of the base material 120, and/or adjacentparticles 600 (FIG. 6) of the powder 121P, 122P, 123P of the basematerial 120). The consolidation and densification of the additivelymanufactured part 150 as described above effects the substantiallysimilar mechanical properties of the additively manufactured part 150 inboth the X-Y plane and the Z direction.

Referring now to FIGS. 1, 2A-2C, 3A, 3B, 6, 7, and 9, an exemplarymethod of additive manufacturing using the additive manufacturingapparatus 100 will be described. A layer 151 of base material 120 fromwhich the additively manufactured part 150 is produced is deposited(FIG. 9, Block 900) onto the base material support bed 103. In oneaspect (as shown in FIGS. 3A, 3B and 4A-4C), the layer 151 of basematerial 120 is formed by depositing (with, for example, a nozzle 310 ofthe base material deposition unit 104) a plurality of filaments 300(where the plurality of filaments 300 include filaments 121F, 122F, 123Fof one of the polymeric material 121, the metal 122, or the polymer 123)on the base material support bed 103 in a side-by-side arrangement.Where the base material 120 is deposited in the form of a filament 121F,122F, 123F, a spacing or air gap 250A, 250B, 250C between adjacentfilaments 121F, 122F, 123F (e.g., from a center of one filament to acenter of an adjacent filament) may be adjusted to provide increased ordecreased coupling between the adjacent filaments 121F, 122F, 123F. Forexample, the air gap 250A shown in FIG. 2A is smaller than the air gap250B shown in FIG. 2B; and, the air gap 250B shown in FIG. 2B is smallerthan the air gap 250C shown in FIG. 2C. Likewise, the coupling area 260Abetween adjacent filaments 121F, 122F, 123F shown in FIG. 2A effected bythe air gap 250A is larger than the coupling area 260B between adjacentfilaments 121F, 122F, 123F shown in FIG. 2B effected by the air gap250B; and, the coupling area 260B between adjacent filaments 121F, 122F,123F shown in FIG. 2B effected by the air gap 250B is larger than thecoupling area 260C between adjacent filaments 121F, 122F, 123F shown inFIG. 2C effected by the air gap 250C. The voids 201 and/or pores 200formed by the air gaps may be filled with the slurry 190 so that the airgap may be adjusted (e.g., larger or smaller) while maintainingsubstantially similar mechanical properties (e.g., tensile strength,etc.) of the additively manufactured part 150. In another aspect (asshown in FIGS. 6, 7A, and 7B), the layer 151 of base material 120 isformed by depositing (e.g., by spreading with for example, doctor blade620 of the base material deposition unit 104) a powdered base material610 (where the powdered base material 610 includes powder 121P, 122P,123P of one of the polymeric material 121, the metal 122, or the polymer123) on the base material support bed 103.

The resin 183 is dissolved in the solvent 181 to form the resin solution180 (FIG. 9, Block 910). Referring also to FIGS. 4A-4C and 6, the resinsolution 180 is deposited (e.g., by spraying, brushing, rolling,solution-deposition planarization, etc.) onto the layer 151 of basematerial 120 (FIG. 9, Block 920). In one aspect, depositing the resinsolution 180 onto the layer 151 of base material 120 includes sprayingthe resin solution 180 onto the layer 151 of base material 120 with thespray nozzle 105S of the deposition device 105. In one aspect, the spraynozzle 105S is stationarily fixed to the frame 101 and the base material120 deposited onto the base material support bed 103. In other aspects,the spray nozzle 105S of the deposition device 105 is movable and ispositioned relative to the layer 151 of base material 120 with thecomputer controlled positioning mechanism 175. One or more of the voids201 and/or pores 200 on a surface of the layer 151 of base material 120are filled with the resin solution 180 (FIG. 9, Block 930—see FIGS. 4Band 7A). As can be seen in FIGS. 4B and 7A, the layer 151 of basematerial 120 is planarized by the resin solution 180 so that, whenanother layer 151 of the base material is deposited on top of the resinsolution 180, any voids 201 and/or pores 200 that may form between theadjacent layers 151 of base material 120 in the resulting stacked layers151S is/are filled by the resin solution 180.

Another layer 151 (see FIGS. 4C and 7B) of base material 120 isdeposited on top of the layer 151 of base material upon which the resinsolution 180 has been applied (FIG. 9, Block 900) to form the stackedlayers 151S (see FIGS. 4C and 7B) of base material 120. The resinsolution 180 is deposited onto the other layer 151 of base material 120(FIG. 9, Block 920—see FIGS. 4C and 7B) so that the one or more of thevoids 201 and/or pores 200 on a surface of the other layer 151 of basematerial 120 are at least partially filled with the resin solution 180(FIG. 9, Block 930—see FIGS. 4C and 7B), where the resin solution 180 atleast partially fills the one or more of the voids 201 and pores 200between adjacent layers 151 of the base material 120 in the stackedlayers 151S of base material 120 so as to reinforce coupling of theadjacent layers 151 of base material 120.

In one aspect, one or more of a thermal conductivity, an electricalconductivity, and a permeability of an additively manufactured partformed by the base material 120 is modified with the resin solution(FIG. 9, Block 940). For example, referring to FIGS. 5A, 5B, and 5C, theresin solution 180 includes one or more of the conductive material 184and the barrier material 199 (FIG. 1B). As described above, where thebase material 120 is deposited in the form of filaments 121F, 122F,123F, the air gap 250A, 250B, 250C between adjacent filaments forms oneor more of voids 201 and pores 200 that extend in, for example, an Xdirection of the additively manufactured part 150. The conductivematerial 184 settles in these voids 201 and/or pores 200 to formconductive pathways 520 (e.g., which may be akin/similar to wireconductors, each having an equivalent wire gauge or size) that alsoextend in the X direction. The wire gauge or size of these conductivepathways 520 may be controlled by setting the air gap 250A, 250B, 250Cto effect a predetermined wire gauge of the conductive pathway 520,noting the wire gauges available may depend on a diameter of thefilament 121F, 122F, 123F being deposited. Where the base material isdeposited in the form of a powder 121P, 122P, 123P (as illustrated inFIG. 7B), the conductive material may settle in the voids 201 and/orpores 200 to form a conductive plane (or sheet) 700 between adjacentlayers 151 of the base material 120. In this aspect, the conductiveplane 700 may extend in the X and Y directions (e.g., the X-Y plane).The barrier material 199 may also settle within the voids 201 and/orpores 200 to form the barrier 400 to prevent fluids from passing betweenthe adjacent filaments 121F, 122F, 123F.

The resin solution 180 deposited upon the layer 151 of base material 120is heated (FIG. 9, Block 950) so as to reduce an amount of solvent 195in the resin solution 180. Reducing the amount of solvent 195facilitates the consolidation of the layers 151 of base material 120 toeach other and the densification of the additively manufactured part 150by curing the resin 183 (e.g., one or more of the reinforcing agent 193and the conductive material 184 bond to the adjacent layers 151 of basematerial 120, to the adjacent filaments 121F, 122F, 123F of the basematerial 120, and/or adjacent particles 600 (FIG. 6) of the powder 121P,122P, 123P of the base material 120). The consolidation anddensification of the additively manufactured part 150, as describedabove, effects the substantially similar mechanical properties of theadditively manufactured part 150 in both the X-Y plane and the Zdirection.

Referring now to FIGS. 1, 2A-2C, 3A, 3B, 6, 7, and 10, an exemplarymethod of additive manufacturing using the additive manufacturingapparatus 100 will be described. A layer 151 of polymeric material 121(or a polymer 123 material) from which the additively manufactured part150 is produced is deposited (FIG. 10, Block 1000) onto the basematerial support bed 103. In one aspect (as shown in FIGS. 3A, 3B and4A-4C) the layer 151 of polymeric material 121 is formed by depositing(with for example, a nozzle 310 of the base material deposition unit104) a plurality of filaments 300 on the base material support bed 103in a side-by-side arrangement. Where the polymeric material 121 isdeposited in the form of a filament 121F, a spacing or air gap 250A,250B, 250C between adjacent filaments 121F (e.g., from a center of onefilament to a center of an adjacent filament) may be adjusted to provideincreased or decreased coupling between the adjacent filaments 121F. Forexample, the air gap 250A shown in FIG. 2A is smaller than the air gap250B shown in FIG. 2B; and, the air gap 250B shown in FIG. 2B is smallerthan the air gap 250C shown in FIG. 2C. Likewise, the coupling area 260Abetween adjacent filaments 121F shown in FIG. 2A effected by the air gap250A is larger than the coupling area 260B between adjacent filaments121F shown in FIG. 2B effected by the air gap 250B; and, the couplingarea 260B between adjacent filaments 121F shown in FIG. 2B effected bythe air gap 250B is larger than the coupling area 260C between adjacentfilaments 121F, 122F, 123F shown in FIG. 2C effected by the air gap250C. The voids 201 and/or pores 200 formed by the air gaps may befilled with the slurry 190 so that the air gap may be adjusted (e.g.,larger or smaller) while maintaining substantially similar mechanicalproperties (e.g., tensile strength, etc.) of the additively manufacturedpart 150. In another aspect (as shown in FIGS. 6, 7A, and 7B), the layer151 of polymeric material 121 is formed by depositing (e.g., byspreading with, for example, doctor blade 620 of the base materialdeposition unit 104) a powdered base material 610 (where the powderedbase material 610 includes powder 121P of the polymeric material 121) onthe base material support bed 103.

Referring also to FIGS. 4A-4C and 6, the slurry 190 is deposited (e.g.,by spraying, brushing, rolling, solution-deposition planarization, etc.)onto the layer 151 of polymeric material 121 to impart at leastconductive properties to the polymeric material 121 (FIG. 10, Block1010), where the slurry 190 includes the conductive material 184. Inother aspects, one or more of magnetic properties and properties ofimpermeability may be imparted by the slurry 190 to the polymericmaterial 121 (FIG. 10, Blocks 1015, 1016), e.g., such as where theslurry includes the magnetic materials and/or nano-platelets describedabove.

In one aspect, depositing the slurry 190 onto the layer 151 of polymericmaterial 121 includes spraying the slurry 190 onto the layer 151 ofpolymeric material 121 with the spray nozzle 105S of the depositiondevice 105. In one aspect, the spray nozzle 105S is stationarily fixedto the frame 101 and the polymeric material 121 deposited onto the basematerial support bed 103. In other aspects, the spray nozzle 105S of thedeposition device 105 is movable and is positioned relative to the layer151 of polymeric material 121 with the computer controlled positioningmechanism 175. One or more of the voids 201 and/or pores 200 on asurface of the layer 151 of polymeric material 121 are filled with theslurry 190 (FIG. 10, Block 1020—see FIGS. 4B and 7A). As can be seen inFIGS. 4B and 7A, the layer 151 of base material 120 is planarized by theslurry 190 so that when another layer 151 of the base material isdeposited on top of the slurry 190 any voids 201 and/or pores 200 thatmay form between the adjacent layers 151 of base material 120 in theresulting stacked layers 151S is/are filled by the slurry 190.

Another layer 151 (see FIGS. 4C and 7B) of polymeric material 121 isdeposited on top of the layer 151 of polymeric material 121 upon whichthe slurry 190 has been applied (FIG. 10, Block 1000) to form stackedlayers 151S (see FIGS. 4C and 7B) of polymeric material 121 where one ormore layers 151 in the stacked layers 151S is imparted at leastconductive properties. The layer of polymeric material 121 and theslurry 190 are alternately deposited to form the stacked layers 151S ofpolymeric material 121 with the slurry 190 interstitially disposedbetween the stacked layers 151S of polymeric material 121. As describedabove, the slurry 190 may also impart magnetic properties and/orproperties of impermeability to the one or more layers 151 in thestacked layers 151S (FIG. 10, Blocks 1015, 1016). The slurry 190 isdeposited onto the other layer 151 of polymeric material 121 (FIG. 10,Block 1010—see FIGS. 4C and 7B), so that the one or more of the voids201 and/or pores 200 on a surface of the other layer 151 of polymericmaterial 121 are filled with the slurry 190 (FIG. 10, Block 1020—seeFIGS. 4C and 7B), where the slurry 190 at least partially fills the oneor more of the voids 201 and pores 200 between adjacent layers 151 ofthe base material 120 in the stacked layers 151S of polymeric material121 so as to reinforce coupling of the adjacent layers 151 of polymericmaterial 121.

In one aspect, one or more conductive pathways 250 are formed in theadditively manufactured part 150 (FIG. 10, Block 1030). For example,referring to FIGS. 5A, 5B, and 5C, the slurry 190 includes at least theconductive material 184 (FIG. 1B). As described above, where thepolymeric material 121 is deposited in the form of filaments 121F, theair gap 250A, 250B, 250C between adjacent filaments 121F forms one ormore of voids 201 and pores 200 that extend, in for example, an Xdirection of the additively manufactured part 150. The conductivematerial 184 settles (e.g., the slurry 190 at least partially fills theone or more of voids 201 and/or pores 200 between adjacent layers 151 ofthe polymeric material 121 in the stacked layers 151S of polymericmaterial 121) in these voids 201 and/or pores 200 to form the conductivepathways 520 (e.g., which may be akin/similar to wire conductors, eachhaving an equivalent wire gauge or size) that also extend in the Xdirection. The wire gauge or size of these conductive pathways 520 maybe controlled by setting the air gap 250A, 250B, 250C to effect apredetermined wire gauge of the conductive pathway 520, noting the wiregauges available may depend on a diameter of the filament 121F, 122F,123F being deposited. Where the polymeric material 121 is deposited inthe form of a powder 121P (as illustrated in FIG. 7B), the conductivematerial may settle in the voids 201 and/or pores 200 to form aconductive plane (or sheet) 700 between adjacent layers 151 of thepolymeric material 121. In this aspect, the conductive plane 700 mayextend in the X and Y directions (e.g., the X-Y plane).

The slurry 190 deposited upon the layer 151 of polymeric material 121 isheated (FIG. 10, Block 1040), so as to reduce an amount of solvent 195in the slurry 190. Reducing the amount of solvent 195 facilitates theconsolidation of the layers 151 of polymeric material 121 to each otherand the densification of the additively manufactured part 150 by curingthe slurry 190 (e.g., one or more of the reinforcing agent 193, theconductive material 184, and the particles of structural material 194bond to the adjacent layers 151 of base material 120, to the adjacentfilaments 121F of the polymeric material 121, and/or adjacent particles600 (FIG. 6) of the powder 121P of the polymeric material 121). Theconsolidation and densification of the additively manufactured part 150,as described above, effects the substantially similar mechanicalproperties of the additively manufactured part 150 in both the X-Y planeand the Z direction.

Still referring to FIGS. 1, 2A-2C, 3A, 3B, 6, 7, and 10, anotherexemplary method of additive manufacturing using the additivemanufacturing apparatus 100 will be described. A layer 151 of polymericmaterial 121 (or a polymer 123 material) from which the additivelymanufactured part 150 is produced is deposited (FIG. 10, Block 1000)onto the base material support bed 103. In one aspect (as shown in FIGS.3A, 3B and 4A-4C) the layer 151 of polymeric material 121 is formed bydepositing (with for example, a nozzle 310 of the base materialdeposition unit 104) a plurality of filaments 300 on the base materialsupport bed 103 in a side-by-side arrangement. Where the polymericmaterial 121 is deposited in the form of a filament 121F, a spacing orair gap 250A, 250B, 250C between adjacent filaments 121F (e.g., from acenter of one filament to a center of an adjacent filament) may beadjusted to provide increased or decreased coupling between the adjacentfilaments 121F. For example, the air gap 250A shown in FIG. 2A issmaller than the air gap 250B shown in FIG. 2B; and, the air gap 250Bshown in FIG. 2B is smaller than the air gap 250C shown in FIG. 2C.Likewise, the coupling area 260A between adjacent filaments 121F shownin FIG. 2A effected by the air gap 250A is larger than the coupling area260B between adjacent filaments 121F shown in FIG. 2B effected by theair gap 250B; and, the coupling area 260B between adjacent filaments121F shown in FIG. 2B effected by the air gap 250B is larger than thecoupling area 260C between adjacent filaments 121F, 122F, 123F shown inFIG. 2C effected by the air gap 250C. The voids 201 and/or pores 200formed by the air gaps may be filled with the slurry 190, so that theair gap may be adjusted (e.g., larger or smaller) while maintainingsubstantially similar mechanical properties (e.g., tensile strength,etc.) of the additively manufactured part 150. In another aspect (asshown in FIGS. 6, 7A, and 7B), the layer 151 of polymeric material 121is formed by depositing (e.g., by spreading with for example, doctorblade 620 of the base material deposition unit 104) a powdered basematerial 610 (where the powdered base material 610 includes powder 121Pof the polymeric material 121) on the base material support bed 103.

Referring also to FIGS. 4A-4C and 6, the slurry 190 is deposited (e.g.,by spraying, brushing, rolling, solution-deposition planarization, etc.)onto the layer 151 of polymeric material 121 to impart at least barrierproperties to the polymeric material 121 (FIG. 10, Block 1016), wherethe slurry 190 includes the barrier material 199 (FIG. 1B). In otheraspects, one or more of magnetic properties and properties of conductiveproperties may be imparted by the slurry 190 to the polymeric material121 (FIG. 10, Blocks 1010, 1015), e.g., such as where the slurryincludes the magnetic materials and/or nano-platelets described above.

In one aspect, depositing the slurry 190 onto the layer 151 of polymericmaterial 121 includes spraying the slurry 190 onto the layer 151 ofpolymeric material 121 with the spray nozzle 105S of the depositiondevice 105. In one aspect, the spray nozzle 105S is stationarily fixedto the frame 101 and the polymeric material 121 deposited onto the basematerial support bed 103. In other aspects, the spray nozzle 105S of thedeposition device 105 is movable and is positioned relative to the layer151 of polymeric material 121 with the computer controlled positioningmechanism 175. One or more of the voids 201 and/or pores 200 on asurface of the layer 151 of polymeric material 121 are filled with theslurry 190 (FIG. 10, Block 1020—see FIGS. 4B and 7A). As can be seen inFIGS. 4B and 7A, the layer 151 of base material 120 is planarized by theslurry 190 so that, when another layer 151 of the base material isdeposited on top of the slurry 190, any voids 201 and/or pores 200 thatmay form between the adjacent layers 151 of base material 120 in theresulting stacked layers 151S is/are filled by the slurry 190.

Another layer 151 (see FIGS. 4C and 7B) of polymeric material 121 isdeposited on top of the layer 151 of polymeric material 121 upon whichthe slurry 190 has been applied (FIG. 10, Block 1000) to form stackedlayers 151S (see FIGS. 4C and 7B) of polymeric material 121 where one ormore layers 151 in the stacked layers 151S is imparted at leastproperties of impermeability. The layer of polymeric material 121 andthe slurry 190 are alternately deposited to form the stacked layers 151Sof polymeric material 121 with the slurry 190 interstitially disposedbetween the stacked layers 151S of polymeric material 121. As describedabove, the slurry 190 may also impart conductive properties and/ormagnetic properties to the one or more layers 151 in the stacked layers151S (FIG. 10, Blocks 1010, 1015). The slurry 190 is deposited onto theother layer 151 of polymeric material 121 (FIG. 10, Block 1016—see FIGS.4C and 7B) so that the one or more of the voids 201 and/or pores 200 ona surface of the other layer 151 of polymeric material 121 are filledwith the slurry 190 (FIG. 10, Block 1020—see FIGS. 4C and 7B), where theslurry 190 at least partially fills the one or more of the voids 201 andpores 200 between adjacent layers 151 of the base material 120 in thestacked layers 151S of polymeric material 121 so as to reinforcecoupling of the adjacent layers 151 of polymeric material 121.

In one aspect, one or more conductive pathways 250 are formed in theadditively manufactured part 150 (FIG. 10, Block 1030), such as forexample, referring to FIGS. 5A, 5B, and 5C, when the slurry 190 includesthe conductive material 184 (FIG. 1B). As described above, where thepolymeric material 121 is deposited in the form of filaments 121F theair gap 250A, 250B, 250C between adjacent filaments 121F forms one ormore of voids 201 and pores 200 that extend in, for example, an Xdirection of the additively manufactured part 150. The conductivematerial 184 settles (e.g., the slurry 190 at least partially fills theone or more of voids 201 and/or pores 200 between adjacent layers 151 ofthe polymeric material 121 in the stacked layers 151S of polymericmaterial 121) in these voids 201 and/or pores 200 to form the conductivepathways 520 (e.g., which may be akin/similar to wire conductors, eachhaving an equivalent wire gauge or size) that also extend in the Xdirection. The wire gauge or size of these conductive pathways 520 maybe controlled by setting the air gap 250A, 250B, 250C to effect apredetermined wire gauge of the conductive pathway 520, noting the wiregauges available may depend on a diameter of the filament 121F, 122F,123F being deposited. Where the polymeric material 121 is deposited inthe form of a powder 121P (as illustrated in FIG. 7B), the conductivematerial may settle in the voids 201 and/or pores 200 to form aconductive plane (or sheet) 700 between adjacent layers 151 of thepolymeric material 121. In this aspect, the conductive plane 700 mayextend in the X and Y directions (e.g., the X-Y plane).

The slurry 190 deposited upon the layer 151 of polymeric material 121 isheated (FIG. 10. Block 1040) so as to reduce an amount of solvent 195 inthe slurry 190. Reducing the amount of solvent 195 facilitates theconsolidation of the layers 151 of polymeric material 121 to each otherand the densification of the additively manufactured part 150 by curingthe slurry 190 (e.g., one or more of the reinforcing agent 193, theconductive material 184, and the particles of structural material 194bond to the adjacent layers 151 of base material 120, to the adjacentfilaments 121F of the polymeric material 121, and/or adjacent particles600 (FIG. 6) of the powder 121P of the polymeric material 121). Theconsolidation and densification of the additively manufactured part 150as described above effects the substantially similar mechanicalproperties of the additively manufactured part 150 in both the X-Y planeand the Z direction.

In the above-described methods, in one aspect, the resin solution 180 orslurry 190, including the conductive material 184 and/or barriermaterial 199 is deposited upon predetermined portions 598 (FIG. 5C) ofthe at least one layer 151 of base material 120 so as to vary theconductive properties and/or properties of impermeability across the atleast one layer 151 of base material 120, where a resin solution 180 orslurry 190 that does not include the conductive material 184 and/or thebarrier material 199 is deposited on the other portions of the at leastone layer 151. The deposit patterns of the resin solution 180 or slurry190 may be aligned in predetermined directions so as to provide anydesired anisotropic conductivity. In the above-described methods, in oneaspect, the resin solution 180 or slurry may be deposited on theexterior surface(s) 500 (see FIG. 5A) of the additively manufacturedpart 150 so as to provide a better (e.g., smoother, where the voids 201and/or pores 200 are at least partially filled in) surface finish 505compared to an exterior surface 500 where the voids 201 and/or pores 200are not filled in by the slurry 190 or resin solution 180.

The following are provided in accordance with the aspects of the presentdisclosure:

A1. A method of additive manufacturing, the method comprising:

depositing a layer of base material from which an additivelymanufactured part is produced;

dissolving a resin in a solvent to form a resin solution; and

depositing the resin solution upon the layer of base material.

A2. The method of paragraph A1, wherein the resin is a thermoplasticresin.

A3. The method of paragraph A1, further comprising depositing anotherlayer of base material on top of the layer of base material upon whichthe resin solution has been deposited.

A4. The method of paragraph A3, further comprising at least partiallyfilling one or more of voids and pores between the layer of basematerial and the other layer of base material with the resin solution.

A5. The method of paragraph A1 (or A2-A4), wherein the solvent has asurface tension of about 22 mN/m to about 41 mN/m.

A6. The method of paragraph A1 (or A2-A5) wherein depositing the layerof base material includes depositing a polymeric material so that thelayer of base material includes a polymer.

A7. The method of paragraph A1 (or A2-A5) wherein depositing the layerof base material includes depositing a metal so that the layer of basematerial includes metallic particles.

A8. The method of paragraph A1 (or any of the preceding paragraphs),wherein depositing the layer of base material includes depositing aplurality of filaments of base material in a side-by-side arrangement soas to form the layer of base material, where

the layer of base material includes one or more of voids and pores, and

depositing the resin solution upon the layer of base material at leastpartially fills the one or more of voids and pores.

A9. The method of paragraph A1 (or A1-A7), wherein depositing the layerof base material includes depositing a powdered base material so as toform the layer of base material, where

the layer of base material includes one or more of voids and pores, and

depositing the resin solution upon the layer of base material at leastpartially fills the one or more of voids and pores.

A10. The method of paragraph A1 (or any of the preceding paragraphs),wherein depositing the resin solution upon the layer of base materialincludes spraying, with a deposition device, the resin solution upon thelayer of base material, where the deposition device is movable.

A11. The method of paragraph A10, further comprising positioning thedeposition device relative to the layer of base material with a computercontrolled positioning mechanism.

A12. The method of paragraph A1 (or A2-A9), wherein depositing the resinsolution upon the layer of base material includes spraying the resinsolution upon the layer of base material with a deposition device thatis fixed relative to the layer of base material.

A13. The method of paragraph A1 (or A2-A9), wherein depositing the resinsolution upon the layer of base material comprises depositing the resinsolution upon the layer of base material by solution-depositionplanarization.

A14. The method of paragraph A1 (or A2-A9), wherein depositing the resinsolution upon the layer of base material comprises depositing the resinsolution by application of a low surface tension melt (please explainwhat this is).

A15. The method of paragraph A1 (or any of the preceding paragraphs),further comprising modifying, with the resin solution, one or more of athermal conductivity, an electrical conductivity, and a permeability ofan additively manufactured part formed with the base material.

A16. The method of paragraph A1, wherein the resin solution includes areinforcing agent.

A17. The method of paragraph A1 (or any of the preceding paragraphs),further comprising heating the resin solution deposited upon the layerof base material so as to reduce an amount of solvent in the resinsolution.

A18. The method of paragraph A1 (or A2-A5) wherein depositing the layerof base material includes depositing a polymer.

B1. A method of additive manufacturing, the method comprising:

depositing a layer of base material;

dissolving a resin in a solvent to form a resin solution; and

depositing the resin solution upon the layer of base material;

wherein the layer of base material and the resin solution arealternately deposited to form stacked layers of base material with theresin solution interstitially disposed between the stacked layers ofbase material, the resin solution at least partially filling one or moreof voids and pores between adjacent layers of base material in thestacked layers of base material so as to reinforce coupling of theadjacent layers of base material.

B2. The method of paragraph B1, wherein the resin is a thermoplasticresin.

B3. The method of paragraph B1 (or B2), wherein the solvent has asurface tension of about 22 mN/m to about 41 mN/m.

B4. The method of paragraph B1 (or B2-B3) wherein depositing the layerof base material includes depositing a polymeric material so that thelayer of base material includes a polymer.

B5. The method of paragraph B1 (or B2-B3) wherein depositing the layerof base material includes depositing a metal so that the layer of basematerial includes metallic particles.

B6. The method of paragraph B1 (or any of the preceding paragraphs),wherein depositing the layer of base material includes depositing aplurality of filaments of base material in a side-by-side arrangement soas to form the layer of base material, where the layer of base materialincludes the one or more of voids and pores.

B7. The method of paragraph B1 (or B1-B5), wherein depositing the layerof base material includes depositing a powdered base material so as toform the layer of base material, where the layer of base materialincludes the one or more of voids and pores.

B8. The method of paragraph B1 (or any of the preceding paragraphs),wherein depositing the resin solution upon the layer of base materialincludes spraying, with a deposition device, the resin solution upon thelayer of base material, where the deposition device is movable.

B9. The method of paragraph B8, further comprising positioning thedeposition device relative to the layer of base material with a computercontrolled positioning mechanism.

B10. The method of paragraph B1 (or B2-B7), wherein depositing the resinsolution upon the layer of base material includes spraying the resinsolution upon the layer of base material with a deposition device thatis fixed relative to the layer of base material.

B11. The method of paragraph B1 (or B2-B7), wherein depositing the resinsolution upon the layer of base material comprises depositing the resinsolution upon the layer of base material by solution-depositionplanarization.

B12. The method of paragraph B1 (or B2-B7), wherein depositing the resinsolution upon the layer of base material comprises depositing the resinsolution by application of a low surface tension melt.

B13. The method of paragraph B1 (or any of the preceding paragraphs),further comprising modifying, with the resin solution, one or more of athermal conductivity, an electrical conductivity, and a permeability ofan additively manufactured part formed with the base material.

B14. The method of paragraph B1, wherein the resin solution includes areinforcing agent.

B15. The method of paragraph B1 (or any of the preceding paragraphs),further comprising heating the resin solution deposited upon the layerof base material so as to reduce an amount of solvent in the resinsolution.

B16. The method of paragraph B1 (or B2-B3) wherein depositing the layerof base material includes depositing a polymer.

C1. An additively manufactured part comprising:

at least one layer of base material; and

a reinforcing agent disposed on the at least one layer of base material,where the reinforcing agent is deposited upon the at least one baselayer as a resin solution so as to at least partially fill one or moreof voids and pores in the at least one layer of base material, whereinthe resin solution effects coupling of the at least one layer of basematerial so that the additively manufactured part exhibits substantiallyisotropic mechanical strength.

C2. The additively manufactured part of paragraph C1, wherein the resinsolution includes a thermoplastic resin.

C3. The additively manufactured part of paragraph C1 (or C2), whereinthe resin solution includes a solvent having a surface tension of about22 mN/m to about 41 mN/m.

C4. The additively manufactured part of paragraph C1 (or C2-C3), whereinthe at least one layer of base material comprises more than one layer ofbase material, the reinforcing agent being interstitially disposedbetween adjacent layers of base material, at least partially filling theone or more of voids and pores, so as to reinforce coupling of theadjacent layers of base material.

C5. The additively manufactured part of paragraph C1 (or C2-C4), whereinthe at least one layer of base material includes a polymer.

C6. The additively manufactured part of paragraph C1 (or C2-C4), whereinthe at least one layer of base material includes a metal.

D1. An additive manufacturing apparatus comprising:

a frame;

a base material support bed coupled to the frame;

a base material deposition unit movably coupled to the frame and beingdisposed above the base material support bed, the base materialdeposition unit being configured to deposit one or more layers of basematerial upon the base material support bed; and

a deposition device coupled to the frame so as to be positioned relativeto the frame and being configured so as to deposit a resin solution uponthe one or more layers of base material, in situ with the deposition ofthe one or more layer of base material.

D2. The additive manufacturing apparatus of paragraph D1, wherein theframe forms a chamber that encloses at least a spray nozzle of thedeposition device, where the resin solution exits the deposition devicethrough the spray nozzle.

D3. The additive manufacturing apparatus of paragraph D1, wherein theframe forms a chamber that encloses at least a portion of the depositiondevice, where the portion of the deposition device is configured toeffect deposition of the resin solution upon the layer of base materialby solution-deposition planarization.

D4. The additive manufacturing apparatus of paragraph D1, wherein theframe forms a chamber that encloses at least a portion of the depositiondevice, where the portion of the deposition device is configured toeffect deposition of the resin solution upon the layer of base materialby application of a low surface tension melt.

D5. The additive manufacturing apparatus of paragraph D1 (or D2-D4),wherein the resin solution includes a solvent and a thermoplastic resin.

D6. The additive manufacturing apparatus of paragraph D1 (or D2-D5),further comprising a controller configured to control positioningmovement of one or more of the base material deposition unit and thedeposition device.

D7. The additive manufacturing apparatus of paragraph D1 (or D2-D6),wherein the base material deposition unit and the deposition device areconfigured so as to move together as a single unit relative to theframe.

D8. The additive manufacturing apparatus of paragraph D1 (or D2-D7),further comprising a heater configured to heat the resin solutiondeposited upon the layer of base material so as to reduce an amount ofsolvent in the resin solution.

D9. The additive manufacturing apparatus of paragraph D1 (or D2-D8),further comprising a reservoir configured to store the resin solutionand being coupled to the deposition device so as to supply the resinsolution to the deposition device.

D10. The additive manufacturing apparatus of paragraph D1 (or D2-D5),wherein the deposition device includes a spray nozzle that is fixedrelative to the base material support bed.

In the figures, referred to above, solid lines, if any, connectingvarious elements and/or components may represent mechanical, electrical,fluid, optical, electromagnetic, wireless and other couplings and/orcombinations thereof. As used herein, “coupled” means associateddirectly as well as indirectly. For example, a member A may be directlyassociated with a member B, or may be indirectly associated therewith,e.g., via another member C. It will be understood that not allrelationships among the various disclosed elements are necessarilyrepresented. Accordingly, couplings other than those depicted in thedrawings may also exist. Dashed lines, if any, connecting blocksdesignating the various elements and/or components represent couplingssimilar in function and purpose to those represented by solid lines;however, couplings represented by the dashed lines may either beselectively provided or may relate to alternative examples of thepresent disclosure. Likewise, elements and/or components, if any,represented with dashed lines, indicate alternative examples of thepresent disclosure. One or more elements shown in solid and/or dashedlines may be omitted from a particular example without departing fromthe scope of the present disclosure. Environmental elements, if any, arerepresented with dotted lines. Virtual (imaginary) elements may also beshown for clarity. Those skilled in the art will appreciate that some ofthe features illustrated in the figures, may be combined in various wayswithout the need to include other features described in the figures,other drawing figures, and/or the accompanying disclosure, even thoughsuch combination or combinations are not explicitly illustrated herein.Similarly, additional features not limited to the examples presented,may be combined with some or all of the features shown and describedherein.

In FIGS. 8-10, referred to above, the blocks may represent operationsand/or portions thereof and lines connecting the various blocks do notimply any particular order or dependency of the operations or portionsthereof. Blocks represented by dashed lines indicate alternativeoperations and/or portions thereof. Dashed lines, if any, connecting thevarious blocks represent alternative dependencies of the operations orportions thereof. It will be understood that not all dependencies amongthe various disclosed operations are necessarily represented. FIGS. 8-10and the accompanying disclosure describing the operations of themethod(s) set forth herein should not be interpreted as necessarilydetermining a sequence in which the operations are to be performed.Rather, although one illustrative order is indicated, it is to beunderstood that the sequence of the operations may be modified whenappropriate. Accordingly, certain operations may be performed in adifferent order or substantially simultaneously. Additionally, thoseskilled in the art will appreciate that not all operations describedneed be performed.

In the following description, numerous specific details are set forth toprovide a thorough understanding of the disclosed concepts, which may bepracticed without some or all of these particulars. In other instances,details of known devices and/or processes have been omitted to avoidunnecessarily obscuring the disclosure. While some concepts will bedescribed in conjunction with specific examples, it will be understoodthat these examples are not intended to be limiting.

Unless otherwise indicated, the terms “first”, “second”, etc. are usedherein merely as labels, and are not intended to impose ordinal,positional, or hierarchical requirements on the items to which theseterms refer. Moreover, reference to, e.g., a “second” item does notrequire or preclude the existence of, e.g., a “first” or lower-numbereditem, and/or, e.g., a “third” or higher-numbered item.

Reference herein to “one example” means that one or more feature,structure, or characteristic described in connection with the example isincluded in at least one implementation. The phrase “one example” invarious places in the specification may or may not be referring to thesame example.

As used herein, a system, apparatus, structure, article, element,component, or hardware “configured to” perform a specified function isindeed capable of performing the specified function without anyalteration, rather than merely having potential to perform the specifiedfunction after further modification. In other words, the system,apparatus, structure, article, element, component, or hardware“configured to” perform a specified function is specifically selected,created, implemented, utilized, programmed, and/or designed for thepurpose of performing the specified function. As used herein,“configured to” denotes existing characteristics of a system, apparatus,structure, article, element, component, or hardware which enable thesystem, apparatus, structure, article, element, component, or hardwareto perform the specified function without further modification. Forpurposes of this disclosure, a system, apparatus, structure, article,element, component, or hardware described as being “configured to”perform a particular function may additionally or alternatively bedescribed as being “adapted to” and/or as being “operative to” performthat function.

Different examples of the apparatus(es) and method(s) disclosed hereininclude a variety of components, features, and functionalities. Itshould be understood that the various examples of the apparatus(es) andmethod(s) disclosed herein may include any of the components, features,and functionalities of any of the other examples of the apparatus(es)and method(s) disclosed herein in any combination, and all of suchpossibilities are intended to be within the scope of the presentdisclosure.

Many modifications of examples set forth herein will come to mind to oneskilled in the art to which the present disclosure pertains having thebenefit of the teachings presented in the foregoing descriptions and theassociated drawings.

Therefore, it is to be understood that the present disclosure is not tobe limited to the specific examples illustrated and that modificationsand other examples are intended to be included within the scope of theappended claims. Moreover, although the foregoing description and theassociated drawings describe examples of the present disclosure in thecontext of certain illustrative combinations of elements and/orfunctions, it should be appreciated that different combinations ofelements and/or functions may be provided by alternative implementationswithout departing from the scope of the appended claims. Accordingly,parenthetical reference numerals in the appended claims are presentedfor illustrative purposes only and are not intended to limit the scopeof the claimed subject matter to the specific examples provided in thepresent disclosure.

What is claimed is:
 1. A method of additive manufacturing, the methodcomprising: depositing a layer of base material from which an additivelymanufactured part is produced; dissolving a resin in a solvent to form aresin solution; and depositing the resin solution upon the layer of basematerial.
 2. The method of claim 1, wherein the resin is a thermoplasticresin.
 3. The method of claim 1, further comprising depositing anotherlayer of base material on top of the layer of base material upon whichthe resin solution has been deposited.
 4. The method of claim 3, furthercomprising at least partially filling one or more of voids and poresbetween the layer of base material and the other layer of base materialwith the resin solution.
 5. The method of claim 1, wherein depositingthe layer of base material includes depositing a plurality of filamentsof base material in a side-by-side arrangement so as to form the layerof base material, where the layer of base material includes one or moreof voids and pores, and depositing the resin solution upon the layer ofbase material at least partially fills the one or more of voids andpores.
 6. The method of claim 1, wherein depositing the layer of basematerial includes depositing a powdered base material so as to form thelayer of base material, where the layer of base material includes one ormore of voids and pores, and depositing the resin solution upon thelayer of base material at least partially fills the one or more of voidsand pores.
 7. The method of claim 1, wherein depositing the resinsolution upon the layer of base material includes spraying, with adeposition device, the resin solution upon the layer of base material,where the deposition device is movable.
 8. The method of claim 7,further comprising positioning the deposition device relative to thelayer of base material with a computer controlled positioning mechanism.9. The method of claim 1, wherein depositing the resin solution upon thelayer of base material includes spraying the resin solution upon thelayer of base material with a deposition device that is fixed relativeto the layer of base material.
 10. The method of claim 1, wherein theresin solution includes a reinforcing agent.
 11. An additivelymanufactured part comprising: at least one layer of base material; and areinforcing agent disposed on the at least one layer of base material,where the reinforcing agent is deposited upon the at least one layer ofbase material as a resin solution so as to at least partially fill oneor more of voids and pores in the at least one layer of base material,wherein the resin solution effects coupling of the at least one layer ofbase material so that the additively manufactured part exhibitssubstantially isotropic mechanical strength.
 12. The additivelymanufactured part of claim 11, wherein the resin solution includes athermoplastic resin.
 13. The additively manufactured part of claim 11,wherein the at least one layer of base material comprises more than onelayer of base material, the reinforcing agent being interstitiallydisposed between adjacent layers of base material, at least partiallyfilling the one or more of voids and pores, so as to reinforce couplingof the adjacent layers of base material.
 14. The additively manufacturedpart of claim 11, wherein the at least one layer of base materialincludes a polymer.
 15. The additively manufactured part of claim 11,wherein the at least one layer of base material includes a metal.
 16. Anadditive manufacturing apparatus comprising: a frame; a base materialsupport bed coupled to the frame; a base material deposition unitmovably coupled to the frame and being disposed above the base materialsupport bed, the base material deposition unit being configured todeposit one or more layers of base material upon the base materialsupport bed; and a deposition device coupled to the frame so as to bepositioned relative to the frame and being configured so as to deposit aresin solution upon the one or more layers of base material, in situwith the deposition of the one or more layer of base material.
 17. Theadditive manufacturing apparatus of claim 16, wherein the frame forms achamber that encloses at least a spray nozzle of the deposition device,where the resin solution exits the deposition device through the spraynozzle.
 18. The additive manufacturing apparatus of claim 16, furthercomprising a controller configured to control positioning movement ofone or more of the base material deposition unit and the depositiondevice.
 19. The additive manufacturing apparatus of claim 16, furthercomprising a heater configured to heat the resin solution deposited uponthe layer of base material so as to reduce an amount of solvent in theresin solution.
 20. The additive manufacturing apparatus of claim 16,further comprising a reservoir configured to store the resin solutionand being coupled to the deposition device so as to supply the resinsolution to the deposition device.